According to the news from Jingrongjie on March 7, 2025, information from the National Intellectual Property Administration shows that Sichuan Winner Special Electronic Materials Co., Ltd. has obtained a patent named "An Integrated Device for Polishing and Coating Bonding Wires", with the authorized announcement number CN 222553156 U, and the application date was March 2024.
The patent abstract shows that the utility model provides an integrated device for polishing and coating bonding wires, which is applicable to the technical field of bonding wires. The problem to be solved is to provide an integrated device for polishing and coating bonding wires. The adopted solution includes: a processing table, a protective shell, a rotating shell, a rotating base and a coating box. The upper surface of the processing table is fixedly connected with the protective shell, a rotating shell is arranged on one side of the protective shell, the upper surface of the processing table is symmetrically and fixedly connected with rotating bases, and a coating box is arranged on the side of the protective shell away from the rotating shell; a first motor, a driving bevel gear and a driven bevel gear. By installing the processing table, protective shell, rotating shell, rotating base, coating box, first motor, driving bevel gear and driven bevel gear, when grinding and polishing the bonding wire raw materials, it can conduct all-round grinding and polishing to ensure the quality of the polished bonding wire raw materials. At the same time, the polished bonding wire raw materials can be quickly coated. The utility model is also applicable to the field of bonding wires.
According to Tianyancha data, Sichuan Winner Special Electronic Materials Co., Ltd. was established in 2009 and is located in Suining City. It is an enterprise mainly engaged in the manufacturing of computers, communication and other electronic equipment. The registered capital of the enterprise is 55.440822 million yuan, and the paid-in capital is 52.674852 million yuan.
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